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200 Mm Wafer Coating and Developing Track Tool Duv

FinlandTenders notice for 200 Mm Wafer Coating and Developing Track Tool Duv. The reference ID of the tender is 131194460 and it is closing on 29 Dec 2025.

Tender Details

  • Country: Finland
  • Summary: 200 Mm Wafer Coating and Developing Track Tool Duv
  • FIT Ref No: 131194460
  • Deadline: 29 Dec 2025
  • Financier: Self Financed
  • Purchaser Ownership: Government
  • Tender Value: Refer Document
  • Notice Type: Tender
  • Document Ref. No.: VTT 74/206/2025
  • Purchaser's Detail:
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  • Description:
  • THE OBJECT OF THE TENDER PROCESSThe object of the procurement is 200 mm wafer coating and developing track tool for VTT Micronova cleanroom semiconductor front end processing. The procurement involves a tool integrated into a DUV exposure tool, but also capable of developing wafers from the i-line stepper in the same facility. The tool features open cassette loading stations, spin coating and developing stations and hot and cool plates, and a module for integration with the DUV exposure tool. The tool also should have an option of extracting processed wafers in open cassettes. The coating and developing track tool is intended to support silicon semiconductor front end processing of 200 mm wafers, facilitating exposure by DUV stepper or other exposure tool. To this end, it must be capable of priming wafers with HMDS, coating wafers with DUV resist and with BARC, and developing DUV and i-line types of exposed resist, with the associated heating and cooling arrangements. The technical specification of the object of the tender is described in more detail in this Annex 1 of the invitation to tender. The tendered Tool must comply with all technical properties and functionalities, performance specifications and acceptance criteria as set out in Annex 1 and Annex 2 ("Facilities, materials and connector types"). A tender which does not meet one or more of the requirements specified in the Annex 1 and Annex 2, may be rejected for failing to comply with the call for tenders.The compare...
  • Documents:

 Tender Notice

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200 Mm Wafer Coating and Developing Track Tool Duv - Finland Tender

The TECHNOLOGY RESEARCH CENTER VTT OY, a Government sector organization in Finland, has announced a new tender for 200 Mm Wafer Coating and Developing Track Tool Duv. This tender is published on FinlandTenders under FIT Ref No: 131194460 and is categorized as a Tender. Interested and eligible suppliers are invited to participate by reviewing the tender documents and submitting their bids before the deadline on 2025-12-29.

The estimated tender value is Refer Document, and full details, including technical specifications and submission requirements, are provided in the official tender documents. Ensure all submissions meet the criteria outlined to be considered for evaluation.

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