- Country: Finland
- Summary: Semi-Automatic Wafer Grinder
- FIT Ref No: 128524434
- Deadline: 17 Nov 2025
- Financier: Self Financed
- Purchaser Ownership: Government
- Tender Value: Refer Document
- Notice Type: Tender
- Document Ref. No.: 689551-2025
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- Description:
- The object of the tender is a Semi-Automatic Wafer Grinder with manual wafer loading and unloading on the chuck table (later also “Equipment”), capable of thinning Si, SiC, LiNbO3 and other typical semi-conducting wafers of 200 and 300 mm diameter to varying thicknesses with end-point control, TTV profile control, capability to thin wafers down to 10um thickness with supporting tape and capability to grind only a determined distance from edge-to-center. Equipment must be new. The tool must comply with cleanroom equipment standard safety and contamination requirements. The object of the tender process is described in more detail in the invitation to tender documents.
Doc Title: Semi-Automatic Wafer Grinder
Contract Type: supplies - Documents:
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CLICK HERE TO LOGINSemi-Automatic Wafer Grinder - Finland Tender
The VTT TECHNICAL RESEARCH CENTRE OF FINLAND LTD, a Government sector organization in Finland, has announced a new tender for Semi-Automatic Wafer Grinder. This tender is published on FinlandTenders under FIT Ref No: 128524434 and is categorized as a Tender. Interested and eligible suppliers are invited to participate by reviewing the tender documents and submitting their bids before the deadline on 2025-11-17.
The estimated tender value is Refer Document, and full details, including technical specifications and submission requirements, are provided in the official tender documents. Ensure all submissions meet the criteria outlined to be considered for evaluation.
